Next Big Future - Latest Comments in DARPA working on Chip-Scale High Energy Atomic Beams

Re: DARPA working on Chip-Scale High Energy Atomic Beams

briannsideen — Thu, 10 Dec 2009 13:32:51 -0000

could you send me all available data on nano-tech transceiver implantive devices (cochleal and upper/lower sinal type),including both audio and visua-video types? thank you,i would also greatfully appreciate all data on corporate manufacturers as well as all data available on the newest reverb.-bounce technology used to maintain connective ability via satellite/tower relay between user and controllers of these devices.

Re: DARPA working on Chip-Scale High Energy Atomic Beams

Diego Delgado — Wed, 08 Jul 2009 04:48:57 -0000

Tip-Based Nanofabrication sounds like molecular manufacturing to me. Its awesome to see darpa taking it seriously.

Re: DARPA working on Chip-Scale High Energy Atomic Beams

nextbigfuture — Tue, 07 Jul 2009 11:25:28 -0000

yes, it was cut and pasted from the DARPA pdfs. Corrected

Re: DARPA working on Chip-Scale High Energy Atomic Beams

leoncaruthers — Tue, 07 Jul 2009 11:20:57 -0000

Demonstrated on-chip cooling to 77 kilo (K) using a photonic fiber heat exchanger

Should the K here be degrees Kelvin, rather than kilo?

Re: DARPA working on Chip-Scale High Energy Atomic Beams

kurt9 — Mon, 06 Jul 2009 22:35:12 -0000

It would be nice to get their research notes from the fy 2009 work. It would be interesting to see this concept and to find out why it may or may not work. A MEMS based fusion power generator would be quite nice.